Metal Finishing Analysis

We provide technical assistance and analytical services to the Metal Finishing Industry. Below is a current listing of the various chemistries that we currenty analyze.

 1. Electrolytic Copper Plating

  • Inorganics- Copper, Copper Sulfate, Sulfuric Acid, Chloride
  • CVS- Brighteners, Carriers & Wetters
  • Hull Cell Analysis
  • Carrier by Solvent Extraction

2. Electrolytic Nickel Plating

  • Nickel Metal
  • Nickel Sulfamate
  • Nickel Chloride or Nickel Bromide
  • pH & Boric Acid
  • Wetter
  • TOC- Total Organic Carbon Content

3. Electrolytic Gold Plating

  • Gold
  • Buffer Salts
  • pH, S.G.
  • Brightener
  • Trace Metal Contaminants

4. Electrolytic Silver Plating

  • Silver
  • pH, Carbonate
  • Potassium or Sodium Cyanide
  • Free Cyanide

5. Electrolytic Tin Plating

  • Tin
  • Methane Sulfonic Acid or Sulfuric Acid
  • Additives-Primary, Secondary, Antioxidant

Project News-05/2017

Burrant Chemical signs formulation developmental project with Total M&S.

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